Organic light-emitting display apparatus and method of manufacturing the same

ABSTRACT

An organic light-emitting display apparatus, including: a first electrode disposed on the substrate; a pixel defining layer covering an edge of the first electrode; a residual layer disposed on the pixel defining layer, the residual layer including a fluoropolymer; a first organic functional layer including a first light emitting layer, the first organic functional layer having a lower surface directly contacting a top surface of the first electrode and a side surface directly contacting the residual layer; and a second electrode disposed on the first organic functional layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a Continuation of U.S. patent application Ser. No.15/704,317, filed on Sep. 14, 2017, which is a continuation of U.S.patent application Ser. No. 15/065,390, filed on Mar. 9, 2016, nowissued as U.S. Pat. No. 9,768,384, and claims priority from and thebenefit of Korean Patent Application No. 10-2015-0103877, filed on Jul.22, 2015, which is hereby incorporated by reference for all purposes asif fully set forth herein.

BACKGROUND Field

Exemplary embodiments relate to an organic light-emitting displayapparatus and a method of manufacturing the same.

Discussion of the Background

An organic light-emitting display apparatus is a self-luminous displayapparatus having a hole injection electrode, an electron injectionelectrode, and an organic light-emitting layer between the holeinjection electrode and the electron injection electrode. As holesinjected by the hole injection electrode and electrons injected by theelectron injection electrode are combined and become neutral in theorganic light-emitting layer, light is emitted. The organiclight-emitting display apparatus has been highlighted as a nextgeneration display apparatus having high quality characteristics, forexample, low power consumption, high brightness, and fast responsespeed.

The above information disclosed in this Background section is only forenhancement of understanding of the background of the inventive concept,and, therefore, it may contain information that does not form the priorart that is already known in this country to a person of ordinary skillin the art.

SUMMARY

Exemplary embodiments provide a method of manufacturing an organiclight-emitting display apparatus, whereby a pattern misalignment may beprevented, a process may be simplified, efficiency may be increased, anda lifespan may be extended, and an organic light-emitting displayapparatus manufactured by the above method.

Additional aspects of the invention will be set forth in the descriptionwhich follows, and, in part, will be apparent from the description, ormay be learned by practice of the inventive concept.

An exemplary embodiment of the present invention discloses a method ofmanufacturing an organic light-emitting display apparatus, including:forming a liftoff layer containing a fluoropolymer on a substrate;forming a photoresist on the liftoff layer and patterning thephotoresist by removing a portion thereof; etching, using a firstsolvent, the liftoff layer in a region where the photoresist is removedso that a portion of the liftoff layer remains on the substrate; formingan etch stop layer above the liftoff layer that remains on the substrateand above a region where the photoresist remains on the liftoff layer;and removing, using a second solvent, the liftoff layer under the regionwhere the photoresist remains on the liftoff layer.

An exemplary embodiment of the present invention also discloses a methodof manufacturing an organic light-emitting display apparatus, including:forming a plurality of first electrodes on a substrate and performing afirst unit process, the first unit process including: forming a liftofflayer containing a fluoropolymer on the substrate on which the pluralityof first electrodes are formed; forming a photoresist on the liftofflayer, and removing the photoresist at a position corresponding to oneof the plurality of first electrodes by a photolithography process;etching the liftoff layer using a first solvent including fluorine sothat a portion of the liftoff layer remains on the one of the pluralityof first electrodes; forming a first organic functional layer includinga light-emitting layer above the liftoff layer that remains on the oneof the plurality of first electrodes and above a region where thephotoresist remains on the liftoff layer; and removing, using a secondsolvent including fluorine, the liftoff layer formed in the region wherethe photoresist remains on the liftoff layer. The method furtherincludes, after performing the first unit process: performing at leastone time a second unit process of forming, in a region where another ofthe plurality of first electrodes different from the one of theplurality of first electrodes is formed, an organic functional layeremitting light of a color different from the color of light emitted bythe first organic functional layer; and, after performing the first andsecond unit processes, forming a second electrode.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concept, and are incorporated in andconstitute a part of this specification, illustrate exemplaryembodiments of the inventive concept, and, together with the descriptionserve to explain the principles of the inventive concept.

FIG. 1 is a flowchart of a manufacturing method according to anexemplary embodiment.

FIG. 2 is a schematic is a cross-sectional view showing an organiclight-emitting display apparatus manufactured by a manufacturing methodaccording to an exemplary embodiment of the present invention.

FIG. 3 is a cross-sectional view schematically showing an operation offorming a plurality of anodes on a substrate in the manufacturing methodof FIG. 2.

FIG. 4A, FIG. 4B, FIG. 4C, FIG. 4D, FIG. 4E, and FIG. 4F arecross-sectional views schematically showing a first unit operation ofthe manufacturing method of FIG. 2.

FIG. 5A, FIG. 5B, FIG. 5C, FIG. 5D, FIG. 5E, and FIG. 5F arecross-sectional views schematically showing a second unit operation ofthe manufacturing method of FIG. 2.

FIG. 6A, FIG. 6B, FIG. 6C, FIG. 6D, FIG. 6E, and FIG. 6F arecross-sectional views schematically showing a third unit operation ofthe manufacturing method of FIG. 2.

FIG. 7 is a schematic cross-sectional view showing an organiclight-emitting display apparatus manufactured by a manufacturing methodaccording to another exemplary embodiment of the present invention.

FIG. 8 is a schematic cross-sectional view showing an organiclight-emitting display apparatus manufactured by a manufacturing methodaccording to still another exemplary embodiment of the presentinvention.

FIG. 9 is a schematic cross-sectional view showing an organiclight-emitting display apparatus manufactured by a manufacturing methodaccording to still another exemplary embodiment of the presentinvention.

FIG. 10 is a graph of an XPS analysis showing that a residual layer of aliftoff layer is formed on an anode.

FIG. 11 is a schematic cross-sectional view showing an organiclight-emitting display apparatus manufactured by a manufacturing methodaccording to still another exemplary embodiment of the presentinvention.

FIG. 12A, FIG. 12B, FIG. 12C, FIG. 12D, FIG. 12E, FIG. 12F, FIG. 12G,FIG. 12H, and FIG. 12I are cross-sectional views schematically showingthe manufacturing method of FIG. 11.

FIG. 13 is a schematic cross-sectional view showing an organiclight-emitting display apparatus manufactured by a manufacturing methodaccording to still another exemplary embodiment of the presentinvention.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments. It is apparent, however,that various exemplary embodiments may be practiced without thesespecific details or with one or more equivalent arrangements. In otherinstances, well-known structures and devices are shown in block diagramform in order to avoid unnecessarily obscuring various exemplaryembodiments.

In the accompanying figures, the size and relative sizes of layers,films, panels, regions, etc., may be exaggerated for clarity anddescriptive purposes. Also, like reference numerals denote likeelements.

When an element or layer is referred to as being “on,” “connected to,”or “coupled to” another element or layer, it may be directly on,connected to, or coupled to the other element or layer or interveningelements or layers may be present. When, however, an element or layer isreferred to as being “directly on,” “directly connected to,” or“directly coupled to” another element or layer, there are no interveningelements or layers present. For the purposes of this disclosure, “atleast one of X, Y, and Z” and “at least one selected from the groupconsisting of X, Y, and Z” may be construed as X only, Y only, Z only,or any combination of two or more of X, Y, and Z, such as, for instance,XYZ, XYY, YZ, and ZZ. Like numbers refer to like elements throughout. Asused herein, the term “and/or” includes any and all combinations of oneor more of the associated listed items.

Although the terms first, second, etc. may be used herein to describevarious elements, components, regions, layers, and/or sections, theseelements, components, regions, layers, and/or sections should not belimited by these terms. These terms are used to distinguish one element,component, region, layer, and/or section from another element,component, region, layer, and/or section. Thus, a first element,component, region, layer, and/or section discussed below could be termeda second element, component, region, layer, and/or section withoutdeparting from the teachings of the present disclosure.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, may be used herein for descriptive purposes, and,thereby, to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the drawings. Spatiallyrelative terms are intended to encompass different orientations of anapparatus in use, operation, and/or manufacture in addition to theorientation depicted in the drawings. For example, if the apparatus inthe drawings is turned over, elements described as “below” or “beneath”other elements or features would then be oriented “above” the otherelements or features. Thus, the exemplary term “below” can encompassboth an orientation of above and below. Furthermore, the apparatus maybe otherwise oriented (e.g., rotated 90 degrees or at otherorientations), and, as such, the spatially relative descriptors usedherein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof.

Various exemplary embodiments are described herein with reference tosectional illustrations that are schematic illustrations of idealizedexemplary embodiments and/or intermediate structures. As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should not beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. The regions illustrated in the drawings are schematic innature and their shapes are not intended to illustrate the actual shapeof a region of a device and are not intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIG. 1 is a flowchart of a manufacturing method according to anexemplary embodiment.

Referring to FIG. 1, in the method of manufacturing an organiclight-emitting display apparatus according to an exemplary embodiment,an anode is formed on a substrate in step S10; a liftoff layercontaining a fluoropolymer is formed on the anode in step S20; aphotoresist is formed on the liftoff layer and patterned by removing aportion of the photoresist in step S30; the liftoff layer is etched in aregion where the photoresist is removed using a first solvent includingfluorine so that a portion of the liftoff layer remains on the anode instep S40, an organic functional layer, including a light-emitting layer,is formed above the liftoff layer remaining on the anode and above theregion where the photoresist remains in step S50; and the liftoff layerformed in the region where the photoresist remains is removed using asecond solvent including fluorine in step S60. The manufacturing methodmay further include an operation of forming a cathode on the organiclight-emitting layer in step S70.

A method of manufacturing an organic light-emitting display apparatusand an organic light-emitting display apparatus manufactured by themanufacturing method according to exemplary embodiments are described indetail with reference to FIGS. 2 to 6F.

FIG. 2 is a schematic cross-sectional view of an organic light-emittingdisplay apparatus 1 manufactured by a manufacturing method according toan exemplary embodiment. FIG. 3 is a cross-sectional view schematicallyillustrating an operation of forming a plurality of anodes on asubstrate by the manufacturing method of FIG. 2. FIGS. 4A to 4F arecross-sectional views schematically illustrating a first unit operationby the manufacturing method of FIG. 2. FIGS. 5A to 5F arecross-sectional views schematically illustrating a second unit operationby the manufacturing method of FIG. 2. FIGS. 6A to 6F arecross-sectional views schematically illustrating a third unit operationby the manufacturing method of FIG. 2.

Referring to FIG. 2, the organic light-emitting display apparatus 1manufactured by a method according to an exemplary embodiment mayinclude a plurality of anodes including a first anode 101, a secondanode 102, and a third anode 103 on a substrate 100. First to thirdresidual layers 121, 122, and 123 of a liftoff layer 120 of FIG. 4Acontaining a fluoropolymer are disposed on the first to third anodes101, 102, and 103. First to third organic functional layers 151, 152,and 153 are disposed on the first to third residual layers 121, 122, and123 of the liftoff layer. A cathode 180 is provided on each of the firstto third organic functional layers 151, 152, and 153.

The first to third residual layers 121, 122, and 123 of the liftofflayer 120 containing a fluoropolymer may control surface energy of thefirst to third anodes 101, 102, and 103, and reinforce external quantumefficiency of the organic light-emitting display apparatus 1, which isdescribed below.

Referring to FIG. 3, a plurality of anodes, including the first anode101, the second anode 102, and the third anode 103, are formed on thesubstrate 100.

The substrate 100 may be formed of various materials. For example, thesubstrate 100 may be formed of glass or plastic. The plastic may beformed of a material having excellent thermal resistance and durabilitycharacteristics, such as, polyimide, polyethylenenaphthalate,polyethyleneterephthalate, polyarylate, polycarbonate, polyetherlmide,or polyethersulfone.

Although not illustrated in FIG. 3, a planar surface is formed above thesubstrate 100 and a buffer layer (not shown) may be further formed onthe planar surface to prevent intrusion of impurity elements. The bufferlayer may be formed of silicon nitride and/or silicon oxide in a singlelayer or in multiple layers.

The first to third anodes 101, 102, and 103, as hole injectionelectrodes, may be formed of a material having a relatively large workfunction. The first to third anodes 101, 102, and 103 may contain atleast one selected from a group consisting of indium tin oxide, indiumzinc oxide, zinc oxide, indium oxide, indium gallium oxide, and aluminumzinc oxide.

Although not illustrated in FIG. 3, the first to third anodes 101, 102,and 103 may be electrically connected to first to third thin filmtransistors (not shown) located between the substrate 100 and the firstto third anodes 101, 102, and 103.

Referring to FIG. 4A, a liftoff layer 120 containing a fluoropolymer isformed on the substrate 100 over the first to third anodes 101, 102, and103.

The fluoropolymer contained in the liftoff layer 120 may be a polymerhaving a 20˜60 wt % fluorine content. For example, the fluoropolymercontained in the liftoff layer 120 may contain at least one ofpolytetrafluoroethylene, polychlorotrifluoroethylene,polydichlorodifluoroethylene, a copolymer of chlorotrifluoroethylene anddichlorodifluoroethylene, a copolymer of tetrafluoroethylene andperfluoroalkylvinylether, a copolymer of chlorotrifluoroethylene andperfluoroalkylvinylether, a copolymer of tetrafluoroethylene andperfluoroalkylvinylether, and a copolymer of chlorotrifluoroethylene andperfluoroalkylvinylether.

The liftoff layer 120 may be formed on the substrate 100 by a coatingmethod, a printing method, or a deposition method. When the liftofflayer 120 is formed by a coating method or a printing method, apatterning process may be performed after performing a curing andpolymerization process, as necessary.

The thickness of the liftoff layer 120 may be equal to or greater thanabout 0.2 μm and equal to or less than about 5 μm. When the liftofflayer 120 becomes undesirably thick, the time it takes to melt theliftoff layer 120 for patterning increases so that a manufacturingprocess time may be extended. When the liftoff layer 120 is undesirablythin, the liftoff layer 120 becomes difficult to lift off.

Referring to FIG. 4B, a photoresist 130 is formed on the liftoff layer120. The photoresist 130 is exposed to light L at a positioncorresponding to the first anode 101 through a first photomask M1,including a first region M11 through which the light L is transmitted.Next, the photoresist 130 that is exposed is developed.

Referring to FIG. 4C, the photoresist 130 has a patterned shape. A firstregion 131 that is a position corresponding to the first anode 101 isremoved from the photoresist 130 that is exposed and developed, andregion 136 remains.

Although in FIG. 4C a positive-type photoresist 130 is described as anexample, a negative-type photoresist may be used. In this case, toobtain a desired pattern, a pattern of the first photomask M1 may bedesigned to be different from the pattern of FIG. 3B.

Referring to FIG. 4D, the liftoff layer 120 is etched using the patternof the photoresist 130 of FIG. 4C.

Because the liftoff layer 120 contains a fluoropolymer, a solventcapable of etching the fluoropolymer may be used as an etchant.

A first solvent (not shown) containing fluorine may be used as anetchant.

The first solvent may contain hydrofluoroether. The hydrofluoroether isan electrochemically stable material as a result of its low interactionwith other materials, and is an environmentally stable material as aresult of its low global warming potential and toxicity.

In an etching process, the liftoff layer 120 formed at a positioncorresponding to the first region 131 (see FIG. 4C) of the photoresist130, that is, above the first anode 101, is etched. In this state, theliftoff layer 120 above the first anode 101 is not entirely etched, butis etched such that a portion of the liftoff layer 120 remains on thefirst anode 101, thereby forming the first residual layer 121 of theliftoff layer 120.

The first residual layer 121 of the liftoff layer 120 containing thefluoropolymer is formed between the first anode 101 and the firstorganic functional layer 151 (see FIG. 2) to function as a surfaceenergy adjustment layer. The first residual layer 121 of the liftofflayer 120 may adjust a charge balance of a device and preventelectrochemical interaction between heterogeneous layers, therebyimproving the lifespan and efficiency of the device, which is describedbelow.

The thickness of the first residual layer 121 of the liftoff layer 120remaining on the first anode 101 may be equal to or greater than about0.5 nm and equal to or less than about 5 nm. Because the first residuallayer 121 of the liftoff layer 120 is an insulation layer containing afluoropolymer, if the first residual layer 121 is undesirably thick,resistance increases so that the first residual layer 121 may bedifficult to be used for a light-emitting device. If the first residuallayer 121 is undesirably thin, the first residual layer 121 may bedifficult to function as the surface energy adjustment layer.

The thickness of the first residual layer 121 of the liftoff layer 120may be adjusted in order to maintain constant device characteristics.

The first residual layer 121 of the liftoff layer 120 may be formed byetching the liftoff layer 120 using the first solvent containinghydrofluoroether, and then performing a drying process by selectivelyadjusting a rinsing process. For example, the first residual layer 121of the liftoff layer 120 may be formed by allowing the liftoff layer 120to contain polytetrafluoroethylene and performing the etching processusing 3M Novec Series 7100˜7300 as the first solvent, and then a dryingprocess without a rinsing process. Alternatively, when the rinsingprocess is performed using 3M Novec Series 7500, the thickness of aresidual layer may be reduced.

When the liftoff layer 120 is etched using the first solvent containinghydrofluoroether and then dried by a spinning method, the first residuallayer 121 of the liftoff layer 120 may be formed. In this connection,the thickness of a residual layer may be adjusted by adjusting spin RPM,time, or an acceleration force.

After the liftoff layer 120 is etched using the first solvent containinghydrofluoroether, the first residual layer 121 of the liftoff layer 120may be formed by performing dry etching using oxygen plasma. In thisstate, the thickness of a residual layer may be adjusted by adjusting aratio between a nitrogen gas and an oxygen gas, plasma power, or time.

FIG. 10 is a graph of an X-ray photoelectron spectroscopy (XPS) analysisshowing that a residual layer of a liftoff layer is formed on an anode.In the graph, the horizontal axis indicates bond energy, and thevertical axis indicates intensity of the bond energy.

Referring to FIG. 10, a first sample 1 denotes a case in which theentire liftoff layer on an anode is removed, and a second sample 2denotes a case in which a residual layer of a liftoff layer is formed onan anode according to the present exemplary embodiment. It may be seenthat the second sample 2 contains CFz and CFx included in a fluorinatedcopolymer, where 1≤x≤3, 1≤z≤3, and x and z are integers.

Alternatively, during the etching of the liftoff layer 120, the firstsolvent containing fluorine forms a first undercut profile UC1 in theliftoff layer 120 under an interface of the first region 131 (see FIG.4C) of the photoresist 130.

The first undercut profile UC1 may enable forming a delicate depositionpattern of a first organic light-emitting layer in a deposition process(see FIG. 4E), which is described below, and may clearly remove theliftoff layer 120 remaining on the substrate 100 in a liftoff process(see FIG. 4F), which is described below.

Referring to FIG. 4E, the first organic functional layer 151, includingthe first organic light-emitting layer, is formed on the structure ofFIG. 4D.

The first organic functional layer 151 may further include at least onefunctional layer of a hole injection layer, a hole transport layer, anelectron injection layer, and an electron injection layer.

In the present exemplary embodiment, the first organic light-emittinglayer is used as an example of the first organic functional layer 151.Therefore, in the following description, the first organic functionallayer and the first organic light-emitting layer will be referred to bythe same reference numeral.

The first organic light-emitting layer 151 may be formed by a vacuumdeposition method. In a deposition process, the liftoff layer 120 andthe photoresist 130 function as masks. A portion of the first organiclight-emitting layer 151 is formed on the first residual layer 121 ofthe liftoff layer 120. The other portion of the first organiclight-emitting layer 151 is formed on the region 136 where thephotoresist 130 remains.

Referring to FIG. 4F, a liftoff process is performed on the structure ofFIG. 4E.

Because the liftoff layer 120 contains a fluoropolymer, a second solventcontaining fluorine is used in the liftoff process. Also, because theliftoff process is performed after the first organic light-emittinglayer 151 is formed, a material having a low reactivity to the firstorganic light-emitting layer 151 may be used as the second solvent. Thesecond solvent may contain hydrofluoroether, as in the first solvent.

As a liftoff layer 126 formed under the region 136 of FIG. 4E where thephotoresist 130 remains is lifted off, the first organic light-emittinglayer 151 formed on the region 136 where the photoresist 130 remains isremoved, and the first organic light-emitting layer 151 formed on thefirst residual layer 121 of the liftoff layer 120 is left as a pattern.The first organic light-emitting layer 151 functions as an etch stopperwith respect to the first residual layer 121 of the liftoff layer 120.

According to a result of the liftoff process, the first residual layer121 of the liftoff layer 120 is formed between the first anode 101 andthe first organic light-emitting layer 151.

The first residual layer 121 of the liftoff layer 120 containing afluoropolymer may be formed between the first anode 101 and the firstorganic light-emitting layer 151 to control surface energy. As the firstresidual layer 121 of the liftoff layer 120 containing a fluoropolymerforms interfacial dipoles at an interface between the heterogeneouslayers such, as the first anode 101 and the first organic light-emittinglayer 151, an effective work function of the first anode 101 isincreased and electrons are confined. Thus, a charge balance isincreased so that external quantum efficiency of an organiclight-emitting device may be improved.

As the first residual layer 121 of the liftoff layer 120 containing afluoropolymer having a low reactivity functions as a zipper to reduceelectrochemical interaction between the first anode 101 and the firstorganic light-emitting layer 151, that is, the two heterogeneous layers,the lifespan of the organic light-emitting device may be increased.

According to the present exemplary embodiment, the first residual layer121 of the liftoff layer 120 containing a fluoropolymer formed betweenthe first anode 101 and the first organic light-emitting layer 151,which controls surface energy of an organic light-emitting device andfunctions as an electrochemical zipper, may be formed in a first unitprocess of forming a pattern of the first organic light-emitting layer151, and not by additional thermal deposition or a costly plasmaprocess.

According to the present exemplary embodiment, because the pattern ofthe first organic light-emitting layer 151 is formed in the liftoffprocess, and not by being deposited using a metal mask (not shown)having an opening, any possible misalignment between the substrate 100and the metal mask may be prevented.

A second unit process of forming the second organic light-emitting layer152 (see FIG. 5F) for emitting light of a different color from the firstorganic light-emitting layer 151, in a region where the second anode 102is located, is performed after performing the above-described first unitprocess. The second unit process is described below with reference toFIGS. 5A to 5F.

Referring to FIG. 5A, the liftoff layer 120 containing a fluoropolymeris formed on the substrate 100 where the first to third anodes 101, 102,and 103 are formed.

The liftoff layer 120 may include a material that is the same as ordifferent from the fluoropolymer used in the first unit process. Theliftoff layer 120 may be formed on the substrate 100 by a coatingmethod, a printing method, or a deposition method.

Referring to FIG. 5B, the photoresist 130 is formed on the liftoff layer120. The photoresist 130 is exposed to light L at a positioncorresponding to the second anode 102 through a second photomask M2,including a second region M22 through which the light L is transmitted.Next, the photoresist 130 that is exposed is developed.

Referring to FIG. 5C, the photoresist 130 has a patterned shape. Asecond region 132 that is a position corresponding to the second anode102 is removed from the photoresist 130 that is exposed and developed,and a region 137 remains.

Referring to FIG. 5D, the liftoff layer 120 is etched using a pattern ofthe photoresist 130 of FIG. 5C.

Because the liftoff layer 120 contains a fluoropolymer, a solventcapable of etching a fluoropolymer may be used as an etchant. A firstsolvent (not shown) containing fluorine may be used as the etchant. Thefirst solvent may contain hydrofluoroether, as in the above-describedfirst unit process. The first solvent may use a material different fromthat used in the first unit process.

The liftoff layer 120 formed at a position corresponding to the secondregion 132 (see FIG. 5C) of the photoresist 130, that is, above thesecond anode 102, is etched by the etching process. The liftoff layer120 on the second anode 102 is not entirely etched, but is etched to anextent such that a portion of the liftoff layer 120 remains on thesecond anode 102, thereby forming the second residual layer 122 of theliftoff layer 120.

The second residual layer 122 of the liftoff layer 120 containing afluoropolymer formed between the second anode 102 and the second organicfunctional layer 152 (see FIG. 5E), which is described below, tofunction as a surface energy adjustment layer. The second residual layer122 of the liftoff layer 120 may adjust a charge balance of a device andprevent electrochemical interaction between heterogeneous layers,thereby improving the lifespan and efficiency of the device.

The thickness of the second residual layer 122 of the liftoff layer 120remaining on the second anode 102 may be equal to or greater than about0.5 nm and equal to or less than about 5 nm. Because the second residuallayer 122 of the liftoff layer 120 is an insulation layer containing afluoropolymer, if the second residual layer 122 is undesirably thick,resistance increases so that the second residual layer 122 may bedifficult to be used for a light-emitting device. If the second residuallayer 122 is undesirably thin, the second residual layer 122 may bedifficult to function as the surface energy adjustment layer.

The thickness of the second residual layer 122 of the liftoff layer 120may be adjusted in order to maintain constant device characteristics.Because a method of adjusting a thickness may be performed in the samemethod as in the first unit process, a detailed description thereof isomitted.

During the etching of the liftoff layer 120, the first solventcontaining fluorine forms a second undercut profile UC2 in the liftofflayer 120 under an interface of the second region 132 (see FIG. 5D) ofthe photoresist 130.

Referring to FIG. 5E, the second organic functional layer 152 includinga second organic light-emitting layer is formed on the structure of FIG.5D.

The second organic functional layer 152 may further include at least onefunctional layer of a hole injection layer, a hole transport layer, anelectron injection layer, and an electron injection layer.

In the present exemplary embodiment, the second organic light-emittinglayer is used as an example of the second organic functional layer 152.Thus, in the following description, the second organic functional layerand the second organic light-emitting layer may have the same referencenumeral.

The second organic light-emitting layer 152 may be formed by a vacuumdeposition method. In a deposition process, the liftoff layer 120 andthe photoresist 130 function as masks. A portion of the second organiclight-emitting layer 152 is formed on the second residual layer 122 ofthe liftoff layer 120. The other portion of the second organiclight-emitting layer 152 is formed on the region 137 where thephotoresist 130 remains.

Referring to FIG. 5F, a liftoff process is performed on the structure ofFIG. 5E.

Because the liftoff layer 120 contains a fluoropolymer, a second solventcontaining fluorine is used in the liftoff process. Also, because theliftoff process is performed after the second organic light-emittinglayer 152 is formed, a material having a low reactivity to the secondorganic light-emitting layer 152 may be used as the second solvent. Thesecond solvent may contain hydrofluoroether, as in the first solvent.

As a liftoff layer 127 formed under the region 137 of FIG. 5E where thephotoresist 130 remains is lifted off, the second organic light-emittinglayer 152 formed on the region 137 where the photoresist 130 remains isremoved, and the second organic light-emitting layer 152 formed on thesecond residual layer 122 of the liftoff layer 120 is left as a pattern.The second organic light-emitting layer 152 functions as an etch stopperwith respect to the second residual layer 122 of the liftoff layer 120.

According to a result of the liftoff process of the second unit process,the second residual layer 122 of the liftoff layer 120 is formed betweenthe second anode 102 and the second organic light-emitting layer 152.

The second residual layer 122 of the liftoff layer 120 containing afluoropolymer may be formed between the second anode 102 and the secondorganic light-emitting layer 152 to control surface energy. As thesecond residual layer 122 of the liftoff layer 120 containing afluoropolymer forms interfacial dipoles at an interface between theheterogeneous layers such as the second anode 102 and the second organiclight-emitting layer 152, an effective work function of the second anode102 is increased and electrons are confined. Thus, a charge balance isincreased so that external quantum efficiency of an organiclight-emitting device may be improved.

As the second residual layer 122 of the liftoff layer 120 containing afluoropolymer having a low reactivity functions as a zipper to reduceelectrochemical interaction between the second anode 102 and the secondorganic light-emitting layer 152, that is, the two heterogeneous layers,the lifespan of the organic light-emitting device may be increased.

A third unit process of forming the third organic light-emitting layer153 (see FIG. 6F) for emitting light of a different color from the firstorganic light-emitting layer 151 and the second organic light-emittinglayer 152, in a region where the third anode 103 is located, isperformed after performing the above-described second unit process. Thethird unit process is described below with reference to FIGS. 6A to 6F.

Referring to FIG. 6A, the liftoff layer 120 containing a fluoropolymeris formed on the substrate 100 where the first to third anodes 101, 102,and 103 are formed.

The liftoff layer 120 may include a material that is the same as ordifferent from the fluoropolymer used in the first unit process and thesecond unit process. The liftoff layer 120 may be formed on thesubstrate 100 by a coating method, a printing method, or a depositionmethod.

Referring to FIG. 6B, the photoresist 130 is formed on the liftoff layer120. The photoresist 130 at a position corresponding to the third anode103 is exposed to light L through a third photomask M3 including a thirdregion M33 through which the light L is transmitted. Next, thephotoresist 130 that is exposed is developed.

Referring to FIG. 6C, the photoresist 130 has a patterned shape. A thirdregion 133 that is a position corresponding to the third anode 103 isremoved from the photoresist 130 that is exposed and developed, andregion 138 remains.

Referring to FIG. 6D, the liftoff layer 120 is etched using a pattern ofthe photoresist 130 of FIG. 6C.

Because the liftoff layer 120 contains a fluoropolymer, a solventcapable of etching the fluoropolymer may be used as an etchant. A firstsolvent (not shown) containing fluorine may be used as the etchant. Thefirst solvent may contain hydrofluoroether as in the above-describedfirst unit process and second unit process. The first solvent may use amaterial different from that used in the first unit process and thesecond unit process.

The liftoff layer 120 formed at a position corresponding to the thirdregion 133 (see FIG. 6C) of the photoresist 130, that is, above thethird anode 103, is etched by the etching process. The liftoff layer 120on the third anode 103 is not entirely etched, but is etched such that aportion of the liftoff layer 120 remains on the third anode 103, therebyforming the third residual layer 123 of the liftoff layer 120.

The third residual layer 123 of the liftoff layer 120 containing afluoropolymer is formed between the third anode 103 and the thirdorganic functional layer 153 (see FIG. 6E), which is described below, tofunction as a surface energy adjustment layer. The third residual layer123 of the liftoff layer 120 may adjust a charge balance of a device andprevent electrochemical interaction between heterogeneous layers,thereby improving the lifespan and efficiency of the device.

The thickness of the third residual layer 123 of the liftoff layer 120remaining on the third anode 103 may be equal to or greater than about0.5 nm and equal to or less than about 5 nm. Because the third residuallayer 123 of the liftoff layer 120 is an insulation layer containing afluoropolymer, if the third residual layer 123 is undesirably thick,resistance increases so that the third residual layer 123 may bedifficult to be used for a light-emitting device. If the third residuallayer 123 is undesirably thin, it may be difficult for the thirdresidual layer 123 to function as the surface energy adjustment layer.

In order to maintain constant device characteristics, the thickness ofthe third residual layer 123 of the liftoff layer 120 may be adjusted.Because a method of adjusting a thickness may be performed in the samemanner as in the first unit process and the second unit process, adetailed description thereof is omitted.

Also, during the etching of the liftoff layer 120, the first solventcontaining fluorine forms a third undercut profile UC3 in the liftofflayer 120 under an interface of the third region 133 (see FIG. 6D) ofthe photoresist 130.

Referring to FIG. 6E, the third organic functional layer 153, includinga third organic light-emitting layer, is formed on the structure of FIG.6D.

The third organic functional layer 153 may further include at least onefunctional layer of a hole injection layer, a hole transport layer, anelectron injection layer, and an electron injection layer.

In the present exemplary embodiment, the third organic light-emittinglayer is used as an example of the third organic functional layer 153.Therefore, in the following description, the third organic functionallayer and the third organic light-emitting layer may have the samereference numeral.

The third organic light-emitting layer 153 may be formed by a vacuumdeposition method. In a deposition process, the liftoff layer 120 andthe photoresist 130 function as masks. A portion of the third organiclight-emitting layer 153 is formed on the third residual layer 123 ofthe liftoff layer 120. The other portion of the third organiclight-emitting layer 153 is formed on the region 138 where thephotoresist 130 remains.

Referring to FIG. 6F, a liftoff process is performed on the structure ofFIG. 6E.

Because the liftoff layer 120 contains a fluoropolymer, a second solventcontaining fluorine is used in the liftoff process. Also, because theliftoff process is performed after the third organic light-emittinglayer 153 is formed, a material having a low reactivity to the thirdorganic light-emitting layer 153 may be used as the second solvent. Thesecond solvent may contain hydrofluoroether, as is contained in thefirst solvent.

As a liftoff layer 128 formed under the region 138 of FIG. 6E where thephotoresist 130 remains is lifted off, the third organic light-emittinglayer 153 formed on the region 138 where the photoresist 130 remains isremoved, and the third organic light-emitting layer 153 formed on thethird residual layer 123 of the liftoff layer 120 is left as a pattern.The third organic light-emitting layer 153 functions as an etch stopperwith respect to the third residual layer 123 of the liftoff layer 120.

According to a result of the liftoff process of the third unit process,the third residual layer 123 of the liftoff layer 120 is formed betweenthe third anode 103 and the third organic light-emitting layer 153.

The third residual layer 123 of the liftoff layer 120 containing afluoropolymer may be formed between the third anode 103 and the thirdorganic light-emitting layer 153 to control surface energy. As the thirdresidual layer 123 of the liftoff layer 120 containing a fluoropolymerforms interfacial dipoles at an interface between the heterogeneouslayers such as the third anode 103 and the third organic light-emittinglayer 153, an effective work function of the third anode 103 isincreased and electrons are confined. Thus, a charge balance isincreased so that external quantum efficiency of an organiclight-emitting device may be improved.

As the third residual layer 123 of the liftoff layer 120 containing afluoropolymer having a low reactivity functions as a zipper to reduceelectrochemical interaction between the third anode 103 and the thirdorganic light-emitting layer 153, that is, the two heterogeneous layers,the lifespan of the organic light-emitting device may be increased.

Referring back to FIG. 2, after the first to third organic functionallayers 151, 152, and 153 are formed in the first to third unitprocesses, the cathode 180 is formed as a common layer.

Although FIG. 2 illustrates that the cathodes 180 formed on the first tothird anodes 101, 102, and 103 are separately formed, the presentdisclosure is not limited thereto, and the cathodes 180 may beintegrally formed.

The first to third organic light-emitting layers 151, 152, and 153 mayemit lights of different colors. When mixed together, the lights emittedby the first to third organic light-emitting layers 151, 152, and 153may form a white light. For example, the first to third organiclight-emitting layers 151, 152, and 153 may emit light having the colorsof red, green, and blue. For example, the first to third organiclight-emitting layers 151, 152, and 153 may configure subpixels forminga unit pixel of the organic light-emitting display apparatus 1.

The organic light-emitting display apparatus 1 of FIG. 2 may representone unit pixel. Also, the present exemplary embodiment may be applied toan organic light-emitting display apparatus having a plurality of theunit pixels of FIG. 2. In other words, a plurality of the first organiclight-emitting layer 151 for emitting a first color in the first unitprocess may be simultaneously formed. Similarly, a plurality of thesecond organic light-emitting layer 152 for emitting a second color inthe second unit process may be simultaneously formed, and a plurality ofthe third organic light-emitting layer 153 for emitting a third color inthe third unit process may be simultaneously formed. A full color may bepresented through the first to third unit processes.

FIG. 7 is a schematic cross-sectional view of an organic light-emittingdisplay apparatus 2 manufactured by a manufacturing method according toanother exemplary embodiment.

The organic light-emitting display apparatus 2 of FIG. 7 may bemanufactured similarly to the above-described manufacturing method ofthe organic light-emitting display apparatus 1 of FIG. 2. In thefollowing description, only the differences from the above-describedmanufacturing method of the organic light-emitting display apparatus 1of FIG. 2 are discussed.

Referring to FIG. 7, a plurality of anodes including the first to thirdanodes 101, 102, and 103 are formed on the substrate 100, and a pixeldefining layer 110 surrounding the edge of the first to third anodes101, 102, and 103 is formed on the substrate 100. The pixel defininglayer 110 defines a light-emitting region and prevents a short-circuitof the first to third anodes 101, 102, and 103, and the cathode 180.

In the present exemplary embodiment, the first to third unit processesare performed after forming the first to third anodes 101, 102, and 103,and the pixel defining layer 110.

The first to third residual layers 121, 122, and 123 of the liftofflayer 120 containing a fluoropolymer on the first to third anodes 101,102, and 103 contacts a surface of the pixel defining layer 110.

The thickness of the first to third residual layers 121, 122, and 123 ofthe liftoff layer 120 may be equal to or greater than about 0.5 nm andequal to or less than about 5 nm, and the first to third organiclight-emitting layers 151, 152, and 153 are respectively formed on thefirst to third residual layers 121, 122, and 123. After the first tothird unit processes are performed, the cathode 180 is formed as acommon layer.

FIG. 8 is a schematic cross-sectional view of an organic light-emittingdisplay apparatus 3 manufactured by a manufacturing method according toanother exemplary embodiment.

The organic light-emitting display apparatus 3 of FIG. 8 may bemanufactured similarly to the above-described manufacturing method ofthe organic light-emitting display apparatus 1 of FIG. 2. In thefollowing description, only the differences from the above-describedmanufacturing method of the organic light-emitting display apparatus 1of FIG. 2 are discussed.

Referring to FIG. 8, a plurality of anodes including the first to thirdanodes 101, 102, and 103 are formed on the substrate 100. First to thirdhole transport layers 191, 192, and 193 are further formed on the firstto third anodes 101, 102, and 103.

The first to third hole transport layers 191, 192, and 193 may includepoly(ethylenedioxythiophene):poly(styrene sulfonic acid) (PEDOT:PSS).Although FIG. 8 illustrates a structure in which the first to third holetransport layers 191, 192, and 193 are all formed, only partial holetransport layers of the first to third hole transport layers 191, 192,and 193 may be formed.

The first to third residual layers 121, 122, and 123 of the liftofflayer 120 containing a fluoropolymer are formed on the first to thirdhole transport layers 191, 192, and 193. The thickness of the first tothird residual layers 121, 122, and 133 of the liftoff layer 120remaining on the first to third hole transport layers 191, 192, and 193is equal to or greater than about 0.5 nm and equal or less than about 5nm. The first to third organic light-emitting layers 151, 152, and 153are formed on the first to third residual layers 121, 122, and 133. Inother words, in the present exemplary embodiment, the liftoff layer 120directly contacts upper surfaces of the first to third hole transportlayers 191, 192, and 193 formed on the first to third anodes 101, 102,and 103. After the first to third unit processes are performed, thecathode 180 is formed as a common layer.

According to the manufacturing method of FIG. 8, the first to thirdresidual layers 121, 122, and 123 of the liftoff layer 120 containing afluoropolymer is formed between the first to third hole transport layers191, 192, and 193 and the first to third organic light-emitting layers151, 152, and 153 to control surface energy. The first to third residuallayers 121, 122, and 123 of the liftoff layer 120 containing afluoropolymer having a low reactivity functions as a zipper to reduceelectrochemical interaction between the first to third hole transportlayers 191, 192, and 193 and the first to third organic light-emittinglayers 151, 152, and 153, that is, the two heterogeneous layers, so asto increase the lifespan of the organic light-emitting device.

FIG. 9 is a schematic cross-sectional view of an organic light-emittingdisplay apparatus 4 manufactured by a manufacturing method according toanother exemplary embodiment.

The organic light-emitting display apparatus 4 of FIG. 9 may bemanufactured similarly to the above-described manufacturing method ofthe organic light-emitting display apparatus 2 of FIG. 7. In thefollowing description, only the differences from the above-describedmanufacturing method of the organic light-emitting display apparatus 2of FIG. 7 are discussed.

Referring to FIG. 9, a plurality of anodes including the first to thirdanodes 101, 102, and 103 are formed on the substrate 100. The pixeldefining layer 110 surrounding edges of the first to third anodes 101,102, and 103 is formed on the substrate 100. The pixel defining layer110 defines a light-emitting region and prevents a short-circuit of thefirst to third anodes 101, 102, and 103 and the cathode 180.

In the present exemplary embodiment, after the first to third anodes101, 102, and 103 and the pixel defining layer 110 are formed, the firstto third unit processes are performed.

The liftoff layer 120 containing a fluoropolymer (see FIG. 4A) is formedin the first unit process. The first residual layer 121 of the liftofflayer 120 is formed on the first anode 101 by etching the liftoff layer120 (see FIG. 4E) using a first solvent (not shown) containing fluorine.

The first organic light-emitting layer 151 is formed on the firstresidual layer 121 of the liftoff layer 120. When the first organiclight-emitting layer 151 is formed, a first auxiliary cathode 181 isconsecutively deposited on the first organic light-emitting layer 151,and the liftoff process is performed.

During the liftoff process, a second solvent (not shown) containingfluorine is used. The second solvent containing fluorine may damage thefirst organic light-emitting layer 151. The first auxiliary cathode 181functions as a barrier with respect to the first organic light-emittinglayer 151 during the liftoff process.

After the first unit process, the second unit process is performed. Inthe second unit process, the liftoff layer 120 containing afluoropolymer (see FIG. 5A) is formed. The liftoff layer 120 (see FIG.5E) is etched using a first solvent (not shown) containing fluorine and,thus, the second residual layer 122 of the liftoff layer 120 is formedon the second anode 102.

The second organic light-emitting layer 152 is formed on the secondresidual layer 122 of the liftoff layer 120. When the second organiclight-emitting layer 152 is formed, a second auxiliary cathode 182 isconsecutively deposited on the second organic light-emitting layer 152and the liftoff process is performed.

During the liftoff process, a second solvent (not shown) containingfluorine is used. The second solvent (not shown) containing fluorine maydamage the second organic light-emitting layer 152. The second auxiliarycathode 182 may function as a barrier with respect to the second organiclight-emitting layer 152 during the liftoff process.

After the second unit process, the third unit process is performed. Inthe third unit process, the liftoff layer 120 containing a fluoropolymer(see FIG. 6A) is formed. The liftoff layer 120 (see FIG. 6E) is etchedusing the second solvent containing fluorine and thus the third residuallayer 123 of the liftoff layer 120 is formed on the third anode 103.

The third organic light-emitting layer 153 is formed on the thirdresidual layer 123 of the liftoff layer 120. When the third organiclight-emitting layer 153 is formed, a third auxiliary cathode 183 isconsecutively deposited on the third organic light-emitting layer 153,and the liftoff process is performed.

During the liftoff process, the second solvent containing fluorine isused. The second solvent containing fluorine may damage the thirdorganic light-emitting layer 153. The third auxiliary cathode 183 mayfunction as a barrier with respect to the third organic light-emittinglayer 153 during the liftoff process.

After the first to third unit processes are performed, the cathode 180is formed as a common layer.

According to the manufacturing method of FIG. 9, the first to thirdauxiliary cathodes 181, 182, and 183 are consecutively deposited on thefirst to third organic light-emitting layers 151, 152, and 153 duringthe deposition of the first to third organic light-emitting layers 151,152, and 153 in each unit process. Accordingly, the first to thirdauxiliary cathodes 181, 182, and 183 may prevent the first to thirdorganic light-emitting layers 151, 152, and 153 from being damaged inthe subsequent liftoff process. Also, because the first to thirdauxiliary cathodes 181, 182, and 183 electrically contact the cathode180 that is commonly formed with respect to a plurality of pixels, afterthe first to third unit processes, a voltage drop of the cathode 180 maybe prevented.

FIG. 11 is a schematic cross-sectional view of an organic light-emittingdisplay apparatus 5 manufactured by a manufacturing method according toanother exemplary embodiment. FIGS. 12A to 12I are cross-sectional viewsschematically illustrating the manufacturing method of FIG. 11.

Referring to FIG. 11, the organic light-emitting display apparatus 5manufactured by the manufacturing method according to the presentexemplary embodiment may include a plurality of anodes including thefirst anode 101, the second anode 102, and the third anode 103 formed onthe substrate 100, and the pixel defining layer 110 surrounding edges ofthe first to third anodes 101, 102, and 103. The pixel defining layer110 defines a light-emitting region and prevents a short-circuit of thefirst to third anodes 101, 102, and 103 and the cathode 180.

A fourth residual layer 124 of the liftoff layer 120 containing afluoropolymer is disposed on the pixel defining layer 110. The first tothird organic light-emitting layers 151, 152, and 153 are respectivelydisposed on the first to third anodes 101, 102, and 103, each of whichbeing formed between the pixel defining layers 110. The cathode 180 thatis a common electrode is provided on the first to third organiclight-emitting layers 151, 152, and 153.

Because the fourth residual layer 124 of the liftoff layer 120, whichcoats the pixel defining layer 110, is formed of a liquid repellentmaterial containing a fluorinated copolymer, without forming the pixeldefining layer 110 using the liquid repellent material, the first tothird organic light-emitting layers 151, 152, and 153 may be formed inan inkjet process, which is described below.

Referring to FIG. 12A, a plurality of anodes including the first anode101, the second anode 102, and the third anode 103 are formed on thesubstrate 100. The pixel defining layer 110 surrounding edges of thefirst to third anodes 101, 102, and 103 is formed on the substrate 100.

Referring to FIG. 12B, the liftoff layer 120 containing a fluoropolymeris formed on the substrate 100 where the first to third anodes 101, 102,and 103 and the pixel defining layer 110 are formed.

Referring to FIG. 12C, the photoresist 130 is formed on the liftofflayer 120. The photoresist 130 at a position corresponding to the pixeldefining layer 110 is exposed to light L through a fourth photomask M4including a fourth region M44 through which the light L is transmitted.Next, the photoresist 130 that is exposed is developed.

Referring to FIG. 12D, the photoresist 130 has a patterned shape. Afourth region 134 that is a position corresponding to the pixel defininglayer 110 is removed from the photoresist 130 that is exposed anddeveloped, and region 139 remains.

Referring to FIG. 12E, the liftoff layer 120 is etched using the patternof the photoresist 130 of FIG. 12D.

Because the liftoff layer 120 includes a fluoropolymer, a solventcapable of etching a fluoropolymer may be used as an etchant.

A first solvent (not shown) containing fluorine may be used as theetchant. The first solvent may contain hydrofluoroether.

The liftoff layer 120 formed at a position corresponding to the fourthregion 134 (see FIG. 12D) of the photoresist 130, that is, above thepixel defining layer 110, is etched by the etching process. The liftofflayer 120 (see FIG. 12D) on the pixel defining layer 110 is not entirelyetched, but is etched such that a portion of the liftoff layer 120remains on the pixel defining layer 110, thereby forming the fourthresidual layer 124 of the liftoff layer 120.

During the etching of the liftoff layer 120, the first solventcontaining fluorine forms a fourth undercut profile UC4 in the liftofflayer 120 under an interface of the fourth region 134 (see FIG. 12D) ofthe photoresist 130.

Referring to FIG. 12F, an etch stop layer 154 is formed on the structureof FIG. 12E. The etch stop layer 154 prevents the fourth residual layer124 of the liftoff layer 120 disposed on the pixel defining layer 110from being etched in the liftoff process which is described below.

Referring to FIG. 12E, the third organic functional layer 153 includinga third organic light-emitting layer is formed on the structure of FIG.6D.

Referring to FIG. 12G, the liftoff process is performed with respect tothe structure of FIG. 12F.

Because the liftoff layer 120 contains a fluoropolymer, the secondsolvent containing fluorine is used in the liftoff process. Because theliftoff process is performed after the etch stop layer 154 is formed, amaterial having a low reactivity to the etch stop layer 154 may be usedas the second solvent. The second solvent may contain hydrofluoroether,as contained in the first solvent.

As the liftoff layer 120 formed under the region 139 (see FIG. 12E)where the photoresist 130 remains is lifted off, the etch stop layer 154formed on the region 139 where the photoresist 130 remains is removed,and the etch stop layer 154 formed on the fourth residual layer 124 ofthe liftoff layer 120 is left as a pattern. The etch stop layer 154functions as an etch stopper with respect to the fourth residual layer124 of the liftoff layer 120.

After the liftoff process, the etch stop layer 154 formed on the fourthresidual layer 124 of the liftoff layer 120 may be removed.

According to a result of the liftoff process, the fourth residual layer124 of the liftoff layer 120 is formed on the pixel defining layer 110.

Referring to FIG. 12H, first to third liquid drops IJR, IJG, and IJB,including an organic light-emitting layer, are dropped onto thestructure of FIG. 12G in an inkjet process.

Referring to FIG. 12I, the first to third organic light-emitting layers151, 152, and 153 are formed on the first to third anodes 101, 102, and103, respectively.

A manufacturing process using an inkjet process is simpler than one thatuses a deposition process and, thus, a manufacturing cost may bereduced. In order to form an organic light-emitting layer by an inkjetprocess, the pixel defining layer 110 may be formed of a liquidrepellent material containing fluorine. The patterning of the pixeldefining layer 110 containing fluorine is performed by aphotolithography process using photoresist containing fluorine. In thisregard, the photoresist is expensive and it is difficult to adjust acontent of fluorine needed for the patterning and a content of fluorineneeded for the inkjet process.

In the present exemplary embodiment, because the fourth residual layer124 of the liftoff layer 120 containing a fluoropolymer that is liquidrepellent is formed to surround the pixel defining layer 110, withouthaving to form the pixel defining layer 110 as a liquid repellent layercontaining fluorine, the pixel defining layer 110 may be easilypatterned. Also, each of the first to third organic light-emittinglayers 151, 152, and 153 may be easily formed between the pixel defininglayers 110 by the inkjet process.

FIG. 13 is a schematic cross-sectional view of an organic light-emittingdisplay apparatus 6 manufactured by a manufacturing method according toan exemplary embodiment.

Referring to FIG. 13, the organic light-emitting display apparatus 6manufactured by the manufacturing method according to the presentexemplary embodiment may include a plurality of anodes including thefirst anode 101, the second anode 102, and the third anode 103, on thesubstrate 100. The pixel defining layer 110 is formed surrounding edgesof the first to third anodes 101, 102, and 103. The pixel defining layer110 defines a light-emitting region to prevent a short-circuit betweenthe first to third anodes 101, 102, and 103 and the cathode 180.

A fifth residual layer 125 of the liftoff layer 120 containing afluoropolymer is disposed on the first to third anodes 101, 102, and 103and the pixel defining layer 110. The first to third organiclight-emitting layers 151, 152, and 153 are respectively disposed on thefirst to third anodes 101, 102, and 103, each of which is formed betweenthe pixel defining layers 110. The cathode 180 that is a commonelectrode is provided on the first to third organic light-emittinglayers 151, 152, and 153.

Because the fifth residual layer 125 of the liftoff layer 120 containinga fluoropolymer that coats the pixel defining layer 110 is liquidrepellent, the first to third organic light-emitting layers 151, 152,and 153 may be formed by an inkjet process without coating the pixeldefining layer 110 with a liquid repellent material.

As the fifth residual layer 125 of the liftoff layer 120 containing afluoropolymer forms interfacial dipoles at an interface between theheterogeneous layers such as the first to third anodes 101, 102, and 103and the first to third organic light-emitting layers 151, 152, and 153,an effective work function of each of the first to third anodes 101,102, and 103 is increased, and electrons are confined. Thus, a chargebalance is increased so that external quantum efficiency of an organiclight-emitting device may be improved. Furthermore, although notillustrated in the above-described drawings, the above-described organiclight-emitting display apparatuses 1, 2, 3, 4, 5, 6, and 7 may furtherinclude an encapsulation member that encapsulates the organiclight-emitting layers 151, 152, and 153. The encapsulation member may beformed of a glass substrate, metal foil, or a thin film encapsulationlayer mixed of an inorganic layer and an organic layer.

According to the above-described example embodiments, the manufacturingprocess of an organic light-emitting display apparatus is simplified andthe pattern misalignment problem may be prevented. Also, the efficiencyof an organic light-emitting display apparatus may be improved, and thelifespan of an organic light-emitting apparatus may be extended.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concept is not limitedto such embodiments, but rather to the broader scope of the presentedclaims and various obvious modifications and equivalent arrangements.

What is claimed is:
 1. An organic light-emitting display apparatus,comprising: a first electrode disposed on a substrate; a pixel defininglayer covering an edge of the first electrode; a residual layer disposedon the pixel defining layer, the residual layer comprising afluoropolymer; a first organic functional layer comprising a first lightemitting layer, the first organic functional layer having a lowersurface directly contacting a top surface of the first electrode and aside surface directly contacting the residual layer; and a secondelectrode disposed on the first organic functional layer.
 2. The organiclight-emitting display apparatus of claim 1, wherein the fluoropolymerhas a fluorine content in a range of about 20˜60 wt %.
 3. The organiclight-emitting display apparatus of claim 1, wherein the fluoropolymercomprises at least one of polytetrafluoroethylene,polychlorotrifluoroethylene, polydichlorodifluoroethylene, a copolymerof chlorotrifluoroethylene and dichlorodifluoroethylene, a copolymer oftetrafluoroethylene and perfluoroalkylvinylether, a copolymer ofchlorotrifluoroethylene and perfluoroalkylvinylether, a copolymer oftetrafluoroethylene and perfluoroalkylvinylether, and a copolymer ofchlorotrifluoroethylene and perfluoroalkylvinylether.
 4. The organiclight-emitting display apparatus of claim 1, wherein a thickness of theresidual layer is equal to or greater than about 0.5 nm and equal to orless than about 5 nm.
 5. The organic light-emitting display apparatus ofclaim 1, wherein the organic functional layer comprises at least onefunctional layer of a hole injection layer, a hole transport layer, anelectro transport layer, and an electron injection layer.
 6. An organiclight-emitting display apparatus, comprising: a first first electrodedisposed on a substrate; a second first electrode disposed separate fromthe first first electrode; a pixel defining layer covering an edge ofthe first first electrode and the second first electrode; a residuallayer disposed on the pixel defining layer, the residual layercomprising a fluoropolymer; a first organic functional layer comprisinga first light emitting layer, the first organic functional layer havinga lower surface directly contacting a top surface of the first firstelectrode and a side surface directly contacting the residual layer; asecond organic functional layer comprising a second light emittinglayer, the second organic functional layer having a lower surfacedirectly contacting a top surface of the second first electrode and aside surface directly contacting the residual layer; and a secondelectrode commonly disposed on the first organic functional layer andsecond organic functional layer.
 7. The organic light-emitting displayapparatus of claim 6, wherein a first color of light emitted from thefirst light emitting layer is different from a second color of lightemitted from the second light emitting layer.
 8. The organiclight-emitting display apparatus of claim 6, further comprising; a firstauxiliary cathode disposed between the first organic functional layerand the second electrode; and a second auxiliary cathode disposedbetween the second organic functional layer and the second electrode. 9.The organic light-emitting display apparatus of claim 8, wherein thefirst auxiliary cathode and the second auxiliary cathode directlycontact the second electrode.
 10. The organic light-emitting displayapparatus of claim 6, wherein the second electrode is integrallydisposed on the first organic functional layer and second organicfunctional layer.